MediaTek has introduced its two latest mid-range processors, the Dimensity 7300 and Dimensity 7300X, which boast a balance of power and energy efficiency due to their advanced 4-nanometer manufacturing process. The main contrast between the two chips lies in the 7300X’s compatibility with foldable smartphones.

Dimensity 7300 and 7300X provide strong performance and artificial intelligence assistance.

The latest Dimensity 7300 chipsets feature an eight-core design, including four Cortex-A78 cores running at 2.5 GHz and four Cortex-A55 cores at 2 GHz. They are paired with the Mali G615 MC2 GPU for graphics processing.

The Dimensity 7300 series is notable for featuring the sixth generation of APU 655, providing AI capabilities that are twice as efficient as earlier versions. This results in notable enhancements in AI-dependent tasks like image recognition and natural language processing.

Both chipsets feature 6E Wi-Fi support, Bluetooth 5.4, and MediaTek HyperEngine enhancements for enhanced gaming performance, offering 20% higher frame rates and energy efficiency compared to rivals.

The primary distinction between the two models lies in the dual display support feature, exclusive to the Dimensity 7300X. This capability is especially beneficial for foldable and multitasking gadgets, as employing two screens can greatly enhance productivity and usability.

When can we expect to witness the initial appearance of phones?

MediaTek has not provided a specific date for the launch of the first devices featuring the new chipsets, but it is highly likely that the Motorola Razr 50 foldable smartphone will be one of the first to utilize the Dimensity 7300X chip in the near future.

OPPO is set to release the Reno 12 5G worldwide with the Dimensity 7300, offering cutting-edge technology to consumers.